? semiconductor components industries, llc, 2011 april, 2011 ? rev. 4 1 publication order number: bs108/d bs108 small signal mosfet 250 mamps, 200 volts, logic level n ? channel to ? 92 this mosfet is designed for high voltage, high speed switching applications such as line drivers, relay drivers, cmos logic, microprocessor or ttl to high voltage interface and high voltage display drivers. features ? low drive requirement, v gs = 3.0 v max ? inherent current sharing capability permits easy paralleling of many devices ? aec qualified ? ppap capable ? this is a pb ? free device* maximum ratings rating symbol value unit drain ? source voltage v dss 200 vdc gate ? source voltage v gs 20 vdc drain current continuous (note 1) pulsed (note 2) i d i dm 250 500 madc total power dissipation @ t a = 25 c derate above t a = 25 c p d 350 6.4 mw mw/ c operating and storage temperature range t j , t stg ? 55 to +150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. the power dissipation of the package may result in a lower continuous drain current. 2. pulse test: pulse width 300 s, duty cycle 2.0%. *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ordering information bs108 = device code a = assembly location y = year ww = work week = pb ? free package marking diagram d g n ? channel s 250 mamps 200 volts r ds(on) = 8 BS108ZL1G to ? 92 (pb ? free) 2000/ammo pack (note: microdot may be in either location) http://onsemi.com to ? 92 case 29 ? 11 style 30 a bs108 yww 1 2 3
bs108 http://onsemi.com 2 electrical characteristics (t c = 25 c unless otherwise noted) characteristic symbol min typ max unit off characteristics drain ? source breakdown voltage (v gs = 0, i d = 10 a) v (br)ds 200 ? ? ? vdc zero gate voltage drain current (v dss = 130 vdc, v gs = 0) i dss ? ? 30 nadc gate ? body leakage current (v gs = 15 vdc, v ds = 0) i gssf ? ? 10 nadc on characteristics (note 3) gate threshold voltage (i d = 1.0 ma, v ds = v gs ) v gs(th) 0.5 ? 1.5 vdc static drain ? to ? source on ? resistance (v gs = 2.0 vdc, i d = 50 ma) (v gs = 2.8 vdc, i d = 100 ma) r ds(on) ? ? ? ? 10 8.0 drain cutoff current (v gs = 0.2 v, v ds = 70 v) i dsx ? ? 25 a forward transconductance (i d = 120 ma, v ds = 20 v) g fs ? 0.33 ? mhos dynamic characteristics input capacitance (v ds = 25 v, v gs = 0, f = 1.0 mhz) c iss ? ? 150 pf output capacitance (v ds = 25 v, v gs = 0, f = 1.0 mhz) c oss ? ? 30 pf reverse transfer capacitance (v ds = 25 v, v gs = 0, f = 1.0 mhz) c rss ? ? 10 pf switching characteristics turn ? on time (see figure 1) t d(on) ? ? 15 ns turn ? off time (see figure 1) t d(off) ? ? 15 ns 3. pulse test: pulse width 300 s, duty cycle = 2.0%. figure 1. switching test circuit figure 2. switching waveforms resistive switching output inverted 50% 10% 50% t off t on v in v out pulse width 90% 10% input 90% 90% 10 v 20 db 50 attenuator pulse generator +25 v v in 40 pf 1.0 m 50 23 50 v out to sampling scope 50 input
bs108 http://onsemi.com 3 package dimensions to ? 92 (to ? 226) case 29 ? 11 issue am style 30: pin 1. drain 2. gate 3. source notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. contour of package beyond dimension r is uncontrolled. 4. lead dimension is uncontrolled in p and beyond dimension k minimum. r a p j l b k g h section x ? x c v d n n xx seating plane dim min max min max millimeters inches a 0.175 0.205 4.45 5.20 b 0.170 0.210 4.32 5.33 c 0.125 0.165 3.18 4.19 d 0.016 0.021 0.407 0.533 g 0.045 0.055 1.15 1.39 h 0.095 0.105 2.42 2.66 j 0.015 0.020 0.39 0.50 k 0.500 --- 12.70 --- l 0.250 --- 6.35 --- n 0.080 0.105 2.04 2.66 p --- 0.100 --- 2.54 r 0.115 --- 2.93 --- v 0.135 --- 3.43 --- 1 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. contour of package beyond dimension r is uncontrolled. 4. lead dimension is uncontrolled in p and beyond dimension k minimum. r a p j b k g section x ? x c v d n xx seating plane dim min max millimeters a 4.45 5.20 b 4.32 5.33 c 3.18 4.19 d 0.40 0.54 g 2.40 2.80 j 0.39 0.50 k 12.70 --- n 2.04 2.66 p 1.50 4.00 r 2.93 --- v 3.43 --- 1 t straight lead bulk pack bent lead tape & reel ammo pack on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 bs108/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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